Tuesday, March 19, 2013

Steamy Apple Pie On The Go

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http://www.yankodesign.com/images/design_news/2013/03/19/up.jpg



The kind of packaging redesign suggested with the UP is very convenient for the Pizza Pies that I buy from McDonalds. Where here it is intended for the fast food Apple Pie, the incisions in this package make it easy to handle and cool the pie while eating.


UP is an apple pie package with incisions that allow the user to push the pie up and out of the package without burning their hands. The incisions also allow heat to escape from the package more easily so the pie can be eaten sooner.


UP is a 2012 red dot award: design concept winner.


Designers: Hsien Jung Cheng & Bang Yan Cai




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(Steamy Apple Pie On The Go was originally posted on Yanko Design)


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  1. Apple Remote But Not By Apple

  2. Apple Peripherals Don’t Have to Look “Apple”

  3. Let’s Get Steamy














via http://www.yankodesign.com


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